发明名称 MOUNTING HEAD AND BONDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To obtain a mounting head by which all leads at an electronic component can be brought into contact with a printed-circuit board in a low pressurization operation by a method wherein a voice coil motor whose moving- part tip comes into contact with a suction part and an elastic member which gives a tensile force to the voice coil motor and to the suction part are installed at a drive means. SOLUTION: A drive part 40 (a drive means) is installed around a shaft 30. The drive part 40 is provided with voice coil motors 41, 42. A collet 60 is connected to fixation parts 41a, 42a at the voice coil motors 41, 42 by tension springs 71, 72. In a mounting head 20 which is built in a bonding apparatus, the collet 60 is tilted until the rear surface 5b of a tape carrier package (TCP) 5 and the surface 6a of a printed-circuit board 6 become parallel, and the inclination of the collet 60 can be maintained. As a result, all leads 5b at the TCP 5 can be brought uniformly into contact with prescribed pads 6b at the printed- circuit board 6 in a low pressurization operation.
申请公布号 JPH09283990(A) 申请公布日期 1997.10.31
申请号 JP19960088225 申请日期 1996.04.10
申请人 TOSHIBA CORP 发明人 KOGA YASUTAKA;TAKABAYASHI HIRONORI
分类号 H01L21/60;H05K13/04 主分类号 H01L21/60
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