| 摘要 |
PROBLEM TO BE SOLVED: To prevent decrease in the pattern accuracy due to steps on a substrate during a resist pattern is formed, by applying a specified soln. on a substrate, crossllnking and hardening the coating film to obtain a conductive solvent-resistant hardened film, forming a pattern as an upper layer and then transferring the pattern to the conductive solvent-resistant hardened film. SOLUTION: A soln. comprising 100 pts.wt. of a soluble conductive polymer as a conductive resist 41 having org. groups which can crosslink with a crosslinking agent by heat, 5 to 1000 pts.wt. of a crosslinking agent and 100 to 100000 pts.wt. of a solvent as the essential components is applied on a substrate comprising a metallic film 3. The obtd. coating film is crosslinked and hardened to obtain a conductive solvent-resistant hardened film having <=10<10> Ω/sq. sheet resistance. Then a pattern is formed as an upper layer on this conductive solvent-resistant hardened film and the pattern is transferred to the conductive solvent-resistant hardened film. The conductive polymer used is such a material that can be applied by spin coating and gives <=10<10> Ω/sq. sheet resistance after hardened. |
