| 摘要 |
PROBLEM TO BE SOLVED: To obtain a printed-wiring board whose warp is reduced after the finish of its production process and which achieves effective measures of electromagnetic waves against magnetic field by a method wherein solder resist layers in which sheetlike magnetic particles, sheetlike nonmagnetic particles and a bonding agent are mixed are formed on the surface and the rear of a multilayer board. SOLUTION: First, a first board 3A in which wiring patterns 2a, 2b are formed on the surface and the rear of a prepreg 1a and a second board 3B in which wiring patterns 2a, 2b are formed on the surface and the rear of a prepreg 1b are bonded via a prepreg 1c, and a four-layer multilayer board 4 is formed. Solder resist layers 5a, 5b in which sheetlilke magnetic particles, sheetlike nonmagnetic particles and a bonding agent are mixed are formed on the surface and the rear of the four-layer multilayer board 4, Thereby, a warp which is generated after the manufacture of the multilayer board can be reduced. In addition, since the magnetic particles are contained in the solder resist layers 5a, 5b, it is possible to obtain a printed-wiring board for the effective measures of electromagnetic wave disturbance against a magnetic field. |
