| 摘要 |
<p>PROBLEM TO BE SOLVED: To contrive miniaturization of a die-bonding device and reduction in the cost of the device by a method wherein the holding position of a wafer is fixed, an X moving member is provided movably in an X direction and the X member is provided with a push-up tool movably in a Y direction. SOLUTION: A non-defective semiconductor chip (a chip which is not put with a bad mark) is searched for by a camera 17 to recognize the non-defective semiconductor chip. Then, if the non-defective semiconductor chip is found out, a Y moving member 11 and a Y moving member 14a are moved so that a push-up tool 12 and a suction tool 16a for pickup use are respectively positioned on the lower side of the target chip and on the upper side of the target chip. After the members 11 and 14a finish moving, the tool 12 pushes up the chip. Therewith, the tool 16a vacuum-sucks the chip.</p> |
