摘要 |
<p>PROBLEM TO BE SOLVED: To surely prevent the slippage of a position in the case of lamination of bus bars without being accompanied with weight increase of the bus bars or expansion of a bead space to the utmost by laminating an insulating substrate on the bus bars in a state to fix the bus bars t a laminating lower jig. SOLUTION: Most bus bars 1 except bus bars 1A are so formed that at least one among a plurality of tabs 16 is projected downward. Accordingly, the tab 16 projected downward is inserted into a tab insertion hole 20 to position the bus bars 1 to a laminating lower jig 3. While, the bus bars 1A having no tab 16 projected downward are positioned to the laminating lower jig 3 by inserting a dummy tab 19 into the tab insertion hole 20. In such a state, when an insulating substrate 2 is laminated on the bus bars 1A, the original tab 16 relating to electrical connection can be surely inserted into a tab insertion hole 12 formed in a specific part on the insulating substrate 2 side without making the slippage of position.</p> |