发明名称 MANUFACTURING OF DISTRIBUTING BOARD ASSEMBLY BODY FOR ELECTRIC JUNCTION BOX
摘要 <p>PROBLEM TO BE SOLVED: To surely prevent the slippage of a position in the case of lamination of bus bars without being accompanied with weight increase of the bus bars or expansion of a bead space to the utmost by laminating an insulating substrate on the bus bars in a state to fix the bus bars t a laminating lower jig. SOLUTION: Most bus bars 1 except bus bars 1A are so formed that at least one among a plurality of tabs 16 is projected downward. Accordingly, the tab 16 projected downward is inserted into a tab insertion hole 20 to position the bus bars 1 to a laminating lower jig 3. While, the bus bars 1A having no tab 16 projected downward are positioned to the laminating lower jig 3 by inserting a dummy tab 19 into the tab insertion hole 20. In such a state, when an insulating substrate 2 is laminated on the bus bars 1A, the original tab 16 relating to electrical connection can be surely inserted into a tab insertion hole 12 formed in a specific part on the insulating substrate 2 side without making the slippage of position.</p>
申请公布号 JPH09284952(A) 申请公布日期 1997.10.31
申请号 JP19960085405 申请日期 1996.04.08
申请人 SUMITOMO WIRING SYST LTD 发明人 ISSHIKI YOSHIHIRO
分类号 H01R25/16;H01B7/00;H02G3/16;H05K1/02;H05K3/20;H05K3/40;H05K7/06;(IPC1-7):H02G3/16 主分类号 H01R25/16
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