| 摘要 |
PROBLEM TO BE SOLVED: To enable resin sealing according to a transfer molding process and to improve sealing reliability by providing a non-through-tapped-hole on the tip part of an external terminal plate so that the surface of the external terminal provided with the tapped hole is not sealed with a resin and is exposed to the outside. SOLUTION: A semiconductor device 1 is mounted via an insulating plate 2 on a heat sink 3 provided with semiconductor device attaching holes 9 therein. An internal wiring board 4 is provided on the insulating plate 2 and electrodes of the semiconductor device 1 are electrically connected to the internal wiring board 4 with wires 5. Further, an external terminal plate 6 is connected to the insulating plate 2. In particular, the tip of the external terminal plate 6 is bent in the direction parallel to the heat sink 3 and a nut 7 with a tapped hole is joined thereto to form a nonthrough-tapped-hole. The nut 7 with the tapped hole is exposed out of a sealing resin 8 only at the upper surface thereof and this exposed surface coincides with the surface of the sealing resin 8. Thus, resin sealing according to a transfer molding process is enabled so that productivity can be improved. |
