| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the adhesion of a semiconductor pellet to a substrate and the adhesive strength of the pellet to the substrate. SOLUTION: This is a semiconductor device, wherein a semiconductor pellet 3 is mounted on the center part on the surface side of a substrate 2, wherein connection pads 2a and 2b are respectively formed on both surfaces of the surface and rear of the substrate 2 and both of the pads 2a and 2b are connected with each other via a multilayer wiring structure 2c formed in the interior of the substrate 2, via a bonding material 5 and at the same time, a gold plating or the like is applied to the center part, whereby an island 1 formed at a high flatness is formed and with the pellet 3 connected electrically with the pads 2a via wires 4, it is hermetically sealed with a molding resin 6 and a ball grid array consisting of a plurality of metal balls 7 is arranged on the pads 2b on the rear of the substrate 2.</p> |
