| 摘要 |
<p>PROBLEM TO BE SOLVED: To wash a semiconductor wafer very well after dicing to remove minute dusts from the wafer by conducting at least washing of the wafer with ultrasonic vibration after dicing. SOLUTION: After dicing, a semiconductor wafer is washed with pure water 3 with ultrasonic waves being applied by an ultrsonic vibrator 2. As for the ultrasonic vibrator 2, a megasonic vibrator which has been used in conventional methods can be used. For washings, pure water with a high purity is used. With the pure water 3 with megasonic vibration flowing like a curtain, an upper face (an element formation face) of the semiconductor wafer 1 is washed with ultrasonic waves being applied to the wafer 1. By this method, a stable and high washing effect can be obtained and thereby the reliability of a product can be kept high and the product can be massproduced with a high yield.</p> |
