| 摘要 |
PROBLEM TO BE SOLVED: To simplify wire bonding by a method wherein a heat-resisting resin film for protecting a monolithic integrated circuit region part and conductor leads coats the surface of the other part except respective external connection terminal lands of a silicon wafer. SOLUTION: A prescribed treatment is performed on a silicon wafer 11 to form a monolithic integrated circuit region part 11, which is incorporated with an active circuit comprising a resistor and a capacitor and a passive circuit comprising a transistor, and a conductor lead circuit, which consists of a plurality of external connection terminal lands 12 and a plurality of conductor leads 13 which couple these lands 12 with electrode pads of the region part 11, from the wafer 16. A heat-resisting resin film 14 for protecting the region part 11 and the leads 13 is formed by coating the surface of the other part except the respective lands 12 of the wafer 16. Thereby, a wire bonding can be simplified and reduction in the manufacturing cost of a semiconductor device can be contrived. |
