| 发明名称 |
SOLDER BUMP APPARATUS, ELECTRONIC COMPONENT AND METHOD FOR FORMING A SOLDER BUMP |
| 摘要 |
<p>The solder bump apparatus includes a substantially conductive region (14) and a slot (16) projecting from the substantially conductive region (14). A solder resist region (12) at least in part surrounds a perimeter of the substantially conductive region (14) and a perimeter of the slot (16). A solder bump (22) is formed on the conductive region (14) and at least a portion of the solder resist region (12).</p> |
| 申请公布号 |
WO9740530(A1) |
申请公布日期 |
1997.10.30 |
| 申请号 |
WO1997US01145 |
申请日期 |
1997.01.24 |
| 申请人 |
MOTOROLA INC. |
发明人 |
MASTERTON, PATRICK, J. |
| 分类号 |
H01L21/48;H01L21/60;H01L23/485;H01L23/498;H05K3/34;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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