Verfahren zum Montieren eines elektronischen Bauelements auf einer flexiblen Leiterplatte

摘要

The invention concerns a method for mounting electronic components and a related flexible printed circuit board. This board is constituted with a first insulation film (1) covering a first insulating resist layer (3), a second insulation film (7) covering a second insulating resist layer (6) and a printed circuit (4) formed between the first insulating resist layer (3) and the second insulating resist layer (6), and a terminal (5a) of an electronic component (5) is disposed on the printed circuit (4), and the second insulation film (7) is pressed and heated.