发明名称 |
Method of manufacturing a metallisation on a piezoelectric substrate |
摘要 |
Producing a metallisation on piezoelectric substrates for surface wave devices involves: (a) applying a thin, continuous and mechanically stable base layer of a metal or alloy, which reacts with the substrate, onto the substrate by conventional thin film technology; and (b) applying an aluminium (alloy) layer. Pref. the base layer consists of titanium and the substrate consists of LiTaO3 or LiNbO3. |
申请公布号 |
EP0803919(A1) |
申请公布日期 |
1997.10.29 |
申请号 |
EP19960106552 |
申请日期 |
1996.04.25 |
申请人 |
SIEMENS MATSUSHITA COMPONENTS GMBH & CO KG |
发明人 |
EISSLER, DIETER, DR. RER. NAT.;HARTEL, CHRISTOPH, DIPL.-ING. (FH);KNAUER, ULRICH, DR. RE. NAT. |
分类号 |
H01L41/29;H03H3/08;H03H9/02 |
主分类号 |
H01L41/29 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|