发明名称 Method and apparatus for reducing perfluorocompound gases from substrate processing equipment emissions
摘要 <p>An apparatus (40,42) for converting PFC gases exhausted from semiconductor processing equipment (10) to less harmful, non-PFC gases. One embodiment of the apparatus (40,42) includes a silicon filter and a plasma generation system. The plasma generation system forms a plasma from the effluent PFC gases. Constituents from the plasma react with silicon and/or oxygen in the filter and convert the effluent PFC gases to less harmful, non-PFC gaseous products and byproducts. Another embodiment includes a plasma generation system and a particle trapping and collection system. The particle trapping and collection system traps silicon containing residue from deposition processes that produces such residue, and the plasma generation system forms a plasma from the effluent PFC gases. Constituents from the plasma react with the collected residue to convert the effluent PFC gases to less harmful, non-PFC gaseous products and byproducts. <IMAGE></p>
申请公布号 EP0781599(A3) 申请公布日期 1997.10.29
申请号 EP19960309542 申请日期 1996.12.24
申请人 APPLIED MATERIALS, INC. 发明人 CHEUNG, DAVID;RAOUX, SEBASTIEN;HUANG, JUDY H.;TAYLOR, WILLIAM N., JR.;FODOR, MARK;FAIRBAIRN, KEVIN
分类号 B01D45/06;B01D53/32;B01D53/46;B01J19/08;B01J19/12;B01J19/24;C23C16/44;H01J37/32;H01L21/205;H01L21/31;H05H1/24;(IPC1-7):B01J19/08;B01D53/70 主分类号 B01D45/06
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