| 发明名称 |
Electrodeposition bath |
| 摘要 |
<p>An electrodeposition bath for depositing a Sn alloy onto a Cu substrate containing a Zn salt. This bath is particularly useful for Pb free alloy, such as a Sn-Bi alloy. The presence of Zn in the elctrodeposition bath greatly influence the bath behaviour and the characteristics of the deposited alloy, even if no Zn is codeposited on the Cu substrate.</p> |
| 申请公布号 |
EP0803592(A1) |
申请公布日期 |
1997.10.29 |
| 申请号 |
EP19970302203 |
申请日期 |
1997.04.01 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CAVALLOTTI, PIETRO LUIGI;SIRTORI, VITTORIO;ZANGARI, GIOVANNI |
| 分类号 |
B23K35/26;C25D3/56;C25D3/60;H05K3/24;H05K3/34;(IPC1-7):C25D3/60 |
主分类号 |
B23K35/26 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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