| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor polishing device which has little edge hanging-down, can attain a flattened semiconductor surface with high surface accuracy, and can observe or measure the polishing amount of the semiconductor surface during polishing easily. SOLUTION: In this semiconductor polishing device, which is provided with a surface plate 10 and a polisher 20 which is formed on the top surface of the surface plate 10 and polishes the surface of a semiconductor 30, the polisher 20 is formed out of epoxy resin to which at least either of glycerine and glaphite powder or carbon whisker is added. A translucent part 32 which passes through in a thickness direction is formed in the polisher 20, and a transparent epoxy layer 40 is clamped between the polisher 20 and the surface plate. This device is also provided with a light source 23 which emits the light toward the transparent epoxy layer 40, a light detecting part 24 which detects the light amount which is taken out through the transparent epoxy layer 40, and a determining part 25 which determines a polishing condition of the surface of the semiconductor 30 based on a change in the quantity of light which is detected by the light detecting part 24. |
