发明名称 POLISHING METHOD AND POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To maintain the even penetration of a polishing fluid into a gap between a polishing object and a polishing pad and lessen polishing unevenness by forming a groove on the surface of a surface plate and mounting the polishing pad thereon for implementing a polishing process. SOLUTION: A spiral groove 40 is formed on the surface of a surface plate 10 in the direction from a center toward an outer end. The groove 40 is formed to have breadth and depth larger than the thickness of a polishing pad 12, and the edge of the groove 40 on the surface plate surface is chamfered to have curvature. In this case, the cross sectional form of the groove 40 is not limited specifically, but may have a V-shaped form, a U-shaped form, an inverted trapezoidal form or the like. Also, the gap of the spiral groove 40 is not limited specifically, but too small a gap hinders sufficient grinding. On the contrary, too large a gap causes insufficiency in the even penetration of a polishing fluid.
申请公布号 JPH09277163(A) 申请公布日期 1997.10.28
申请号 JP19960093861 申请日期 1996.04.16
申请人 SONY CORP 发明人 SATO HIROSHI
分类号 B24B37/12;B24B37/16;H01L21/304 主分类号 B24B37/12
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