| 摘要 |
One mould section, working with a second one, borders a hollow to receive injected plastic for a semiconductor moulding. It is provided with means to press at least part of the semiconductor lead frame against the second section. This consists of blocks moving in the closing direction and actuated by hydraulic rams. The rams are mechanically attached to the pressing blocks. The blocks may have variable lengths. Also claimed is an injection moulding apparatus containing a mould as described above. |
