发明名称 ROOM-TEMPERATURE CURING TWO-PACKAGE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a room-temperature curing two-package composition excellent in the adhesion to an acrylic coating by forming package A containing a modified silicone compound and an epoxy resin curing agent and package B containing an epoxy resin, a silanol condensation catalyst and a compound represented by a specified formula. SOLUTION: Package A is prepared by mixing 100 pts.wt. modified silicone compound prepared by introducing reactive silicon groups into both terminals of polypropylene oxide with 1.8-70 pts.wt. epoxy resin curing agent (e.g. polyethylenetetramine) and optionally 1-10 pts.wt. mercaptosilane compound, about 0.5-5 pts.wt. aminosilane compound, and a filler. Package B is prepared by mixing 30-70 pts.wt. epoxy resin (e.g. epichlorohydrin-bisphenol A epoxy resin) with 0.5-5 pts.wt. silanol condensation catalyst (e.g. dibutyltin dilaurate), a compound represented by formula I and used in an amount in which the value calculated according to the calculation formula [(the rosin skeleton part of formula II/formula I)×(the number of pts.wt.)] may fall within the range of 1.5-1.8, and a filler. Packages A and B are combined to form a room- temperature curing two-package adhesive.
申请公布号 JPH09279048(A) 申请公布日期 1997.10.28
申请号 JP19960091085 申请日期 1996.04.12
申请人 SEKISUI CHEM CO LTD 发明人 KOBAYASHI MASAYA;FUTAMURA TAKAHIRO
分类号 C08K5/05;C08L101/00;C08L101/10;C09D163/00;C09J163/00;(IPC1-7):C08L101/10 主分类号 C08K5/05
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