| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition with well-balanced physical properties, high in the bond strength of the plating film therefrom, developing no crack and/or blister of such films under cold cycles, thus useful for manufacturing plated products, by incorporating a specific resin (mixture) with a specific organosilicon compound. SOLUTION: This resin composition is obtained by incorporating (A) 100 pts.wt. of a resin (mixture) comprising (A1 ) a graft copolymer 15-100% in graft rate, prepared by graft polymerization, to (A1 ') a rubbery polymer 0.15-0.40μm in weight-average particle size, >=100,000 in the weight-average molecular weight of toluene solubles, >=40wt.% in gel content and 15-50 in swelling degree produced by polymerization between an aliphatic conjugated diene-based monomer and, optionally, a vinyl cyanide-based monomer (M1 ) etc., of a mixture of the monomer M1 and an aromatic vinyl monomer M2 and, optionally, another copolymerizable vinyl monomer M3 and, optionally, (A2 ) a copolymer between the monomers M1 and M2 and, optionally, the monomer M3 , with (B) 0.01-0.5 pt.wt. of an organosilicon compound 5-10,000cSt in viscosity at 25 deg.C.
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