发明名称 RESIN COMPOSITION FOR EXTRUSION LAMINATE MOLDING
摘要 PROBLEM TO BE SOLVED: To obtain a resin composition for extrusion laminate molding excellent in transparency, impact strength, piercing impact strength, heat sealing characteristics such as low-temperature heat salability, heat sealing strength and admixture heat salability, hot tack properties, neck-in, drawdown, etc. SOLUTION: This composition comprises 98-2wt.% of an ethylene homopolymer or an ethylene/α-olefin copolymer obtained by polymerizing ethylene or ethylene and a 3-20Cα-olefin in the presence of a cyclopentadiene compound and a transition metal compound of the group IV of the periodic table and satisfying requirements of 0.86-0.96g/cm<3> density, 0.1-100g/10 minutes melt flow rate, 1.5-5.0 molecular weight distribution and <=2.00 composition distribution parameter and 2-80wt.% of another ethylenic polymer and has 1-50g/10 minutes melt flow rate, 1.10-3.00 DSR at 190 deg.C and 0.5-4.0g melt tension at 190 deg.C.
申请公布号 JPH09278953(A) 申请公布日期 1997.10.28
申请号 JP19960091550 申请日期 1996.04.12
申请人 NIPPON PETROCHEM CO LTD 发明人 WAKAYAMA MASAHIRO;MIYOSHI KIMIYA;OKUYAMA HIROO;KASAHARA HIROSHI;MARUYAMA SATOSHI
分类号 B32B27/32;B29C47/00;B29K23/00;B29L7/00;C08F4/60;C08F4/642;C08F4/6592;C08F210/00;C08L23/00;C08L23/04;(IPC1-7):C08L23/04 主分类号 B32B27/32
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