| 摘要 |
<p>The manufacture of a substrate for mounting an image sensor chip used at the time of constituting a contact type image sensor is extremely simplified and the analog output of the image sensor can hardly carry noise. A prescribed number of photoelectric conversion elements (28), analog switches (29) which are respectively connected in series with the elements (28), a switching circuit (30) which successively turns on the switches (29) by using clock signals, output loads (31 and 40) which are commonly connected in series with each set of one photoelectric conversion element (28) and its corresponding analog switch (29), an amplifier circuit (32) which amplifies the potentials on the element (28) side of the loads (31 and 40), and, preferably, a resistor R for adjusting the gain of the circuit (32) are integrally assembled as a light receiving section. The gain adjusting resistor R is provided with a plurality of resistors Ra1, Ra2, Ra3, Ra4, Rb1, Rb2, Rb3, and Rb4 connected in series and disconnectable by-pass lines (50) provided for all or part of the resistors.</p> |
