摘要 |
<p>A semiconducting floor covering which consists of a layer (2) of conductive material parallel to the surface of the covering and at least one layer (1, 3) of polyvinyl chloride based material adhered to the layer of conductive material. As plasticizer for the polyvinyl chloride in the floor covering, 2-ethyl hexyl diphenyl phosphate and aliphatic ester compound has been used or these two combined so that per 100 parts of polyvinyl chloride it contains 30-80 parts of plasticizer. It further contains 1-250 parts of talc and/or ATH as filler.</p> |