Silicone die attach adhesive and method for fabrication of semiconductor devices

摘要

A siloxane composition is described that is useful as a silicone die attach adhesive. Said composition cures both through the free radical reaction of acrylic-functional organopolysiloxane as induced by exposure to high-energy radiation and through the hydrosilylation reaction between alkenyl-functional organopolysiloxane and silicon-bonded hydrogen-functional organopolysiloxane. Also claimed is a fabrication method of mounting a semiconductor chip on a substrate or in a package with the aforesaid composition sandwiched between the semiconductor chip and substrate or package, then inducing the free radical reaction of the acrylic functional groups by exposing said composition to high-energy radiation, and thereafter curing by the hydrosilylation reaction. A semiconductor device is also claimed that has been fabricated by the above method.