发明名称 |
Wiring board and its manufacturing method |
摘要 |
<p>In a compact wiring board of efficient cooling performance allowing a large current to flow, obtain a wiring board capable of preventing parts from slipping out only by inserting lead bases. The constitution comprises a step of individually preparing a metal plate having a wiring pattern and a provisional linking portion for linking the wiring pattern, and an insulating material sheet for reinforcement, a step of laminating and integrating them, and a step of cutting off and removing the provisional linking portion thereafter. <IMAGE></p> |
申请公布号 |
EP0802711(A2) |
申请公布日期 |
1997.10.22 |
申请号 |
EP19970302538 |
申请日期 |
1997.04.14 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
HISAZUMI, TAKAO;IWAMOTO, HIROSHI;SHIMIZU, KAORU |
分类号 |
H05K1/11;H05K1/02;H05K3/00;H05K3/20;H05K3/22;H05K3/30;H05K3/32;H05K3/38;H05K3/40;H05K5/00;H05K7/06;(IPC1-7):H05K13/00 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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