发明名称 Wiring board and its manufacturing method
摘要 <p>In a compact wiring board of efficient cooling performance allowing a large current to flow, obtain a wiring board capable of preventing parts from slipping out only by inserting lead bases. The constitution comprises a step of individually preparing a metal plate having a wiring pattern and a provisional linking portion for linking the wiring pattern, and an insulating material sheet for reinforcement, a step of laminating and integrating them, and a step of cutting off and removing the provisional linking portion thereafter. &lt;IMAGE&gt;</p>
申请公布号 EP0802711(A2) 申请公布日期 1997.10.22
申请号 EP19970302538 申请日期 1997.04.14
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 HISAZUMI, TAKAO;IWAMOTO, HIROSHI;SHIMIZU, KAORU
分类号 H05K1/11;H05K1/02;H05K3/00;H05K3/20;H05K3/22;H05K3/30;H05K3/32;H05K3/38;H05K3/40;H05K5/00;H05K7/06;(IPC1-7):H05K13/00 主分类号 H05K1/11
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