| 发明名称 |
Manufacturing method of semiconductor acceleration sensor |
| 摘要 |
A process for manufacturing a semiconductor acceleration sensor 12 from a semiconductor wafer 1 is disclosed, wherein a piezoresistor 21 is formed on the semiconductor wafer 1 and the wafer 1 is fixed for dicing with a blade 3 using a freezing chuck 6. <IMAGE> |
| 申请公布号 |
EP0802416(A2) |
申请公布日期 |
1997.10.22 |
| 申请号 |
EP19970302661 |
申请日期 |
1997.04.18 |
| 申请人 |
SEIKO INSTRUMENTS R&D CENTER INC. |
发明人 |
SHINOGI, MASATAKA;SAITOH, YUTAKA;KATO, KENJI |
| 分类号 |
B81B3/00;B81C1/00;G01P15/08;G01P15/12;H01L21/301;H01L29/84 |
主分类号 |
B81B3/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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