发明名称 |
Semiconductor devices, method of connecting semiconductor devices, and semiconductor device connectors |
摘要 |
Semiconductor devices suited for high-density packaging, a method of connecting such semiconductor devices, and connectors for connecting such semiconductor devices. Each semiconductor device 10 includes a plurality of exposed terminals 13 arranged two-dimensionally on opposite surfaces thereof. Each connector 30 includes a plurality of connecting pins projecting from opposite surfaces thereof and arranged two-dimensionally in a corresponding relationship to the exposed terminals 13. Each end connector 33 includes connecting pins 34 likewise arranged two-dimensionally on an inward surface thereof. These connectors 30 and 33 are used to sandwich a plurality of semiconductor devices 10 to form a package. The exposed terminals 13 of the semiconductor devices 10 are electrically connected through the connecting pins of the connectors 30 and 33. <IMAGE> |
申请公布号 |
EP0802566(A2) |
申请公布日期 |
1997.10.22 |
申请号 |
EP19960110808 |
申请日期 |
1996.07.04 |
申请人 |
NISSIN CO., LTD |
发明人 |
NISHIDA, TORU |
分类号 |
H01L25/00;H01L23/32;H01L25/065;H01L25/07;H01L25/10;H01L25/11;H01L25/18;H01R13/24;H05K1/14;H05K1/18;H05K3/28;H05K7/02 |
主分类号 |
H01L25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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