发明名称 Method and apparatus for baking out a gate valve in a semiconductor processing system
摘要 <p>A device for achieving vacuum conditions more quickly in a semiconductor processing system having a vacuum pump (4), a gate valve (6) and a chamber (2) includes a rigid body containing heating elements (9) that contact the surface of the gate valve. The device may include a U-shaped retainer clip (26) for holding the device to the gate valve. A method for heating a gate valve to drive off contaminants involves heating the lower portion (8) of the gate valve to drive contaminants towards the vacuum pump. <IMAGE></p>
申请公布号 EP0802363(A2) 申请公布日期 1997.10.22
申请号 EP19970302630 申请日期 1997.04.17
申请人 APPLIED MATERIALS, INC. 发明人 FRANKLIN, TIMOTHY JOSEPH;HUO, DAVID DATONG
分类号 F16K3/00;F04B37/08;F04B37/16;F16K49/00;F16K51/02;H01L21/203;(IPC1-7):F16K51/02 主分类号 F16K3/00
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