发明名称 |
Method and apparatus for baking out a gate valve in a semiconductor processing system |
摘要 |
<p>A device for achieving vacuum conditions more quickly in a semiconductor processing system having a vacuum pump (4), a gate valve (6) and a chamber (2) includes a rigid body containing heating elements (9) that contact the surface of the gate valve. The device may include a U-shaped retainer clip (26) for holding the device to the gate valve. A method for heating a gate valve to drive off contaminants involves heating the lower portion (8) of the gate valve to drive contaminants towards the vacuum pump. <IMAGE></p> |
申请公布号 |
EP0802363(A2) |
申请公布日期 |
1997.10.22 |
申请号 |
EP19970302630 |
申请日期 |
1997.04.17 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
FRANKLIN, TIMOTHY JOSEPH;HUO, DAVID DATONG |
分类号 |
F16K3/00;F04B37/08;F04B37/16;F16K49/00;F16K51/02;H01L21/203;(IPC1-7):F16K51/02 |
主分类号 |
F16K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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