发明名称
摘要 A flexible circuit board device for connecting to an electronic device comprised of a flexible circuit board made from flexible resistive film, an adhesive layer formed on the flexible resistive film, electrical conductive circuits formed on the adhesive layer and cured films filling the gaps between the conductive circuits. The electrical conductive circuits are formed of conductor metal foil and a plating film covering the surface of the conductor.
申请公布号 JP2665134(B2) 申请公布日期 1997.10.22
申请号 JP19930220043 申请日期 1993.09.03
申请人 发明人
分类号 H01B5/14;H01B13/00;H01R11/00;H01R43/00;H05K1/00;H05K3/24;H05K3/28;H05K3/32;H05K3/34;H05K3/36;H05K3/38;(IPC1-7):H01B5/14 主分类号 H01B5/14
代理机构 代理人
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