Resist compositions for circuit boards

摘要

A resist composition having an excellent heat resistance and capable of sufficiently withstanding to an alkali bath at pH of not less than 14 and a bath temperature of 80 DEG C is provided without degrading photosensitive properties by using an uncured novolac type epoxy resin, a part of epoxy group of which is acrylated, as a resin component of a photosensitive resin matrix and adding an imidazole curing agent.