发明名称 SOLDERING CHECK DEVICE AND METHOD TAKING ADVANTAGE OF RELATIVE NEURON NETWORK
摘要 <p>PROBLEM TO BE SOLVED: To enable a soldering check device to be applied to a check for the shape of a soldered part, by a method wherein the soldering check device is equipped with a recognition means which is capable of learning the boundary conditions of the hierarchies of an object of recognition to classify receiving picture image data extracted from a measurement means and recognizing the shape of a soldered part imitating a human classifying ability basing on sampled learning data when a new picture image is inputted. SOLUTION: A recognition means which recognizes the shape of a soldered part is capable of calculating a relative relation between pattern hierarchies to classify for the shape of a soldered part 2 converting the optional sampled picture image data extracted from a color picture image acquisition section under specific lighting conditions into vector data for a check for a soldered part 2. A relative neural network 10 which is capable of learning the synapse weight of nerve cells through the result of a comparison between the relative value and the judgment value of a user and recognizing the classification condition of the sampled picture image data of the soldered part. A sampled pattern average error function is obtained comparing the vector relative value with the judgment result of a user, whereby the shape of a soldered part can be checked.</p>
申请公布号 JPH09275272(A) 申请公布日期 1997.10.21
申请号 JP19960224189 申请日期 1996.08.26
申请人 SAMSUNG ELECTRON CO LTD 发明人 KIN SHIYOUTEI
分类号 G01R31/317;B23K1/00;G01N21/956;G01R31/04;G01R31/309;G06T7/00;H05K3/34;(IPC1-7):H05K3/34 主分类号 G01R31/317
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