| 摘要 |
PROBLEM TO BE SOLVED: To prevent contamination due to resin and decrease of solder bondability, and improve resin sealing, by forming a base part exposed on the surface of a sealing body and a bent part which closely comes into contact with the exposed base part on the surface of the sealing body and is bent. SOLUTION: Inner leads 3 are bonded to the bottom surface where electrode terminals 1A of a semiconductor chip 1 of, e.g. a DRAM, are arranged, by using insulating adhesive agent 2. The electrode terminals 1A and Ag-plated surfaces 3A of the inner leads 3 are wire-bonded by using Au wires 4. Inner leads 5 for joint use are installed between the electrode terminals 1A and the inner leads 3, and outer leads 6 are installed continuously to the inner leads 3. The outer lead 6 is provided with a bent part 6A having a solder-plated layer 6D on an exposed base part 6C and a surface 6B. The inner leads 3, the bonding wires 4, the inner leads 5 for joint use and the outer leads 6 are sealed on the bottom surface of the semiconductor chip 1 by using mold resin 7. |
