发明名称 Polishing aparatus and method
摘要 A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.
申请公布号 US5679059(A) 申请公布日期 1997.10.21
申请号 US19950563295 申请日期 1995.11.28
申请人 EBARA CORPORATION;KABUSHIKI KAISHA TOSHIBA 发明人 NISHI, TOYOMI;TOGAWA, TETSUJI;SAITO, HARUMITSU;TSUJIMURA, MANABU;YAJIMA, HIROMI;HIMUKAI, KAZUAKI;KODAMA, SHOICHI;IMOTO, YUKIO;AOKI, RIICHIRO;WATASE, MASAKO;SHIGETA, ATSUSHI;MISHIMA, SHIRO;KOUNO, GISUKE
分类号 H01L21/304;B08B1/04;B24B27/00;B24B37/04;B24B37/34;B24B51/00;B24B55/12;F24F3/16;H01L21/00;(IPC1-7):B24B1/00 主分类号 H01L21/304
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