Integrated heterostructures of Group III-V nitride semiconductor materials including epitaxial ohmic contact, non-nitride buffer layer and methods of fabricating same

摘要

An n-on-p integrated heterostructure device of Group III-V nitride compound semiconductor materials is formed on a substrate of p-type monocrystalline silicon carbide and includes a buffer layer of p-type aluminum nitride or p-type aluminum gallium nitride on the substrate. The n-on-p integrated heterostructure includes continuously graded layers of aluminum gallium nitride to reduce or eliminate conduction band or valence band offsets. A multiple quantum well may also be used instead of the continuously graded layer. The n-on-p integrated heterostructure device may include lasers, LEDs and other devices. A p-type negative electron affinity (NEA) photoelectron emitter device may also be provided, including a p-type monocrystalline silicon carbide substrate, a layer of p-type aluminum nitride or aluminum gallium nitride, a continuously graded layer of aluminum gallium nitride and a layer of p-type aluminum gallium nitride. A surface enhancement layer may be located on the layer of aluminum gallium nitride. A multiple quantum well may be used instead of the continuously graded layer of aluminum gallium nitride. An ultraviolet-sensitive NEA device may thereby be provided.