发明名称 |
Wafer grinding machine |
摘要 |
The wafer grinding machine uses a centrally located robot to move a wafer from an input station to a measuring station. Thereafter, the wafer is moved into a grind station and a wash station sequentially. The robot is able to move a wafer from the wash station to either the measuring station for after-grinding measurements or directly to an output station. During grinding of one wafer, a second wafer may be held between the measuring station and the grind station while a ground wafer is moved from the wash station to the measuring station for after-grinding measurements.
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申请公布号 |
US5679060(A) |
申请公布日期 |
1997.10.21 |
申请号 |
US19950549969 |
申请日期 |
1995.10.30 |
申请人 |
SILICON TECHNOLOGY CORPORATION |
发明人 |
LEONARD, THOMAS E.;PAGANO, JOHN C. |
分类号 |
B24B37/04;B24B41/00;(IPC1-7):B24B1/00;B24B7/19;B24B7/30 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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