发明名称 Conductive encapsulating shield for an integrated circuit
摘要 A conductive shield on the surface of an integrated circuit package improves the circuit and package performance. The conductive shield in the vicinity of the leads reduces lead inductance, thus increasing the frequency range of the package and reducing switching induced noise in digital circuits. The shield also blocks radio energy from entering or leaving the package through shielded area.
申请公布号 US5679975(A) 申请公布日期 1997.10.21
申请号 US19950574049 申请日期 1995.12.18
申请人 INTEGRATED DEVICE TECHNOLOGY, INC. 发明人 WYLAND, CHRISTOPHER PAUL;TEMPLETON, JR., THOMAS HENRY
分类号 H01L23/552;H01L23/58;H01L23/64;(IPC1-7):H01L23/552 主分类号 H01L23/552
代理机构 代理人
主权项
地址