| 摘要 |
A mechanically conformable thermally conductive interface for use in electrically isolating and thermally connecting printed circuit boards to either beat sinks, metal chasses, or heat spreaders. The interface material utilizes silicone polymers of controlled molecular weight and a surface layer of a pressure sensitive adhesive may be employed. The silicone polymer is filled with a thermally conductive electrically insulative particulate such as alumina and/or boron nitride, with the silicone being prepared as a reaction product of a liquid organosiloxane together with a chain extender such as a hydride terminated polydimethylsiloxane material. A release film such as polyethylene may be utilized as the undersurface layer, if desired.
|
