| 摘要 |
PROBLEM TO BE SOLVED: To realize highly accurate positioning by varying the optical transmittance of supporting film with a mark portion and non-mark portion of a region used at least for positioning the supporting film. SOLUTION: At first, a resist 5 is coated to the film surface at the side where the mark 4 is not formed of a support film 2 formed with a positioning mark 4. Next, exposure is performed from the mark side and patterning is performed for the resist 5. Next, the surface at the side where the resist 5 is formed is etched by using SF6 gas from RIE equipment, and the thickness of support film of the marked portion is adjusted. Lastly, an excluding peel-off solution is used for peeling off the resist 5. In this way, the film pressure is controlled so as to control the thickness of the support film 2 of non-marked portion for increasing the transmittance and also control the thickness of the support film 2 of the marked portion 4 for reducing the reflectance by an X- absorbing body. In this way, the efficiency of positioning can be increased and the positioning can be performed with a high accuracy. |
