ELECTROLYTIC COPPER FOIL FOR FINE PATTERN

摘要

PROBLEM TO BE SOLVED: To produce an electrolytic copper foil enabling to deal with fine patterning, a copper-plated laminate substrate and a printed circuit board using same. SOLUTION: The surface roughness Rz of the roughened surface of an electrolytic copper foil for fine pattern is controlled to <=6μm by flattering a depositing surface of an untreated foil, which contains <=18ppm carbon, to form a flattened surface having <=5μm surface roughness and roughening at least one surface of this flattened surface or glossy surface of the untreated foil.