| 摘要 |
PROBLEM TO BE SOLVED: To detect a bonding wire effectively at high precision. SOLUTION: A bonding wire detection device 11 of a wire bonding device 10 provided with an imaging device 12 for imaging a bonding wire 5 has prisms 15A1 , 15A2 , 15B and 15C which are arranged between a bonding wire and an imaging device, and pick up an image of right and left bonding wires to a semiconductor pellet 1 which is far therefrom simultaneously and lead it to an imaging device. The imaging device 12 is constituted so that an image of right and left bonding wires to the semiconductor pellet 1 which is far therefrom can be imaged in the same visual field. |
