发明名称 |
Polishing apparatus |
摘要 |
A polishing apparatus for polishing a surface of an object such as a semiconductor wafer includes a turntable having a polishing cloth mounted on an upper surface thereof, a top ring for holding and pressing the object against the polishing cloth, and a plurality of radially arranged nozzles for supplying a polishing solution, containing abrasive material, of different concentrations that differ along a radial direction of the polishing cloth. |
申请公布号 |
US5679063(A) |
申请公布日期 |
1997.10.21 |
申请号 |
US19960590477 |
申请日期 |
1996.01.24 |
申请人 |
EBARA CORPORATION;KABUSHIKI KAISHA TOSHIBA |
发明人 |
KIMURA, NORIO;ISHII, YOU;YASUDA, HOZUMI;SAITO, KOJI;WATASE, MASAKO;MISHIMA, SHIRO |
分类号 |
B24B37/00;B24B37/04;B24B57/02;(IPC1-7):B24B7/00 |
主分类号 |
B24B37/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|