| 摘要 |
PROBLEM TO BE SOLVED: To make sure connection with high reliability by previously forming a resin for protection on the conductor patterns exposed from the notched parts formed on a flexible insulating substrate before bending the substrate. SOLUTION: The resin 7 for protection, such as silicone resin, is applied on both surfaces of the leads 2 exposed from the parts provided with the notched parts 1b, 1c which are the desired parts to be bent and is cured by left standing one whole day and night. The resin 7 for protection is applied between the leads 2 as well. The leads 2 are thereafter connected to the electrode terminals of a liquid crystal cell 9 by using an anisotropic conductive film 8. The IC chip side is then raised upward and the flexible wiring board is bent to an inverted U shape in the parts formed with the notches 1b, 1c. Since the notched parts are formed in the bending parts, the need for curved parts like those of the conventional wiring boards is eliminated and the formation of the wiring board to a smaller size is made possible. Since the wirings of the bent parts are protected, the shorting and disconnecting of the lead wires are prevented and the reliability is improved. |
