| 摘要 |
PROBLEM TO BE SOLVED: To enable measurement free from error, by driving a relative position.attitude changing means in such a manner that the measurement visual field of a visual means is sequentially moved at corrected coordinate positions corrected by a correcting means. SOLUTION: Prior to the inspection of a wafer bump, recognition numbers are imparted to all the chips of a chip group in a wafer. X-Y coordinate axes are set in such a manner that the X axis coincides with the left side of the chip group. A measurement visual field of the recognition number is set for each X, Y position, concerning the measurement visual field of a 3D measurement module 33, in such a manner that 3D measurement of the whole chip group is performed while overlapping. Also about the total number of the visual fields, setting is previously performed. The XY moving axes of an XY stage of a wafer moving stage 32 are made to coincide with the XY coordinate axes, and the mechanical origin of the XY stage is made to coincide with the coordinate origin. By sequentially moving the XY stage in accordance with the visual field coordinate position of the visual field origin of the measurement visual field, the 3D measurement of the chip group is performed. Thereby measurement is enabled without error. |
