| 摘要 |
PROBLEM TO BE SOLVED: To prevent excess pressure on the insulating film and the connection pad under the bump electrode of a semiconductor chip at the time of bonding the bump electrode of the semiconductor chip on the connection pad and the like on a circuit board with pressure. SOLUTION: A bump electrode is composed of an inner bump electrode 19 and an outer protruding electrode 22 which is formed by isotropically covering the inner bump electrode 19. In such case, the outer bump electrode 22 is composed of a bottom bump electrode part 22a whose plane size is same as that of a connection pad 12, and a top bump electrode part 22b whose plane size is smaller than that of an opening part 14 of the insulating film 13. Since the plane size of the top bump electrode part 22b of the outer bump electrode 22 is smaller than that of the top bump electrode 22b, only low pressure is required for bonding, and such pressure is dispersed by the bottom bump electrode 22a whose plane size is large and the inner bump electrode 19. |
