| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject adhesive agent including a specific polyimide resin as a principal component, useful in the field of semiconductor-mounting materials etc., having both heat resistance and low-temperature short-time adhesion property, high in reliability, generating no moisture while processing and also excellent in continuous workability and environmental compatibility. SOLUTION: This adhesive agent is obtained by including an organic solvent- soluble polyimide resin as a principal component synthesized by reaction of amines consisting of (A)αmol. of a compound of formula I (R<1> is a divalent hydrocarbon group), (B)βmol. of a compound of formula II (R<2> is R<1> ; (n) is 2 to 20) and (C)γmol. of other diamines with acids consisting of (D)δmol. of 3,3',4,4'-diphenl sulfone tetracarboxylic dianhydride and (E)εmol. of other acid dianhydrides in the ratios of 0.02<=α/(α+β+γ)<=0.050,β/(α+β+γ)<=0.02, 0.6<=δ/(δ+ε) and 0.96<=(δ+ε)/(α+β+γ)<=1.04 with these formulas simultaneously meeted, followed by imido ring formation.
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