Method for assembly of printed circuit boards with ultrafine pitch components using organic solderability preservatives

摘要

A method of assembling a printed circuit (PC) boards with ultrafine pitch components. The method comprises: attaching a coarse pitch components on the PC board; applying solvent to the thermal pads of the ultrafine pitch components; mounting a die-attach film on the thermal pads; curing the die-attach film; applying solvent to the die-attach film; forming component leads for the ultrafine pitch components; aligning the ultrafine pitch components to the solder pads; attaching the component leads to the solder pads and the ultrafine pitch components to the thermal pads. Other devices, systems and methods are also disclosed.