发明名称 |
Method of planarizing a semiconductor workpiece surface |
摘要 |
The present invention relates to a simple, low cost planarization technique whereby physical pressure is used to planarize the surface of a semiconductor device. The method of the present invention planarizes a semiconductor workpiece surface and results in an increase in the productivity of the processing steps that follow. In effect, the present invention applies physical pressure to flatten the surface layers of a semiconductor workpiece. The present invention is particularly adapted for use in planarizing surface layers made of plastic materials.
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申请公布号 |
US5679610(A) |
申请公布日期 |
1997.10.21 |
申请号 |
US19940356541 |
申请日期 |
1994.12.15 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
MATSUDA, TETSUO;OKUMURA, KATSUYA |
分类号 |
H01L21/3205;H01L21/3105;(IPC1-7):H01L21/31 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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