REMOVING METHOD OF STATIC ELECTRICITY IN THE WAFER

摘要

The method is to eliminate static electricity on a wafer generated during the processes of fabricating a semiconductor device by attaching a protection tape for preventing static electricity on a semiconductor substrate. The method comprises the steps of: depositing a glue layer which contains a wetting agent on the protection tape; attaching a stripe protection film, which is formed by attaching a separation tape on the glue layer, on the semiconductor substrate, where a circuit pattern is formed, in the absence of the isolation tape.