| 摘要 |
The method of positioning a header assembly on a mounting surface of an electrical apparatus involves providing a header assembly with a dielectrical housing and a number of terminals mounted on the housing, with the terminals having tail portions exposed to an upper side of the housing and pin portions projecting from another side of the housing. A slip-off cover is provided with a number of pin-receiving passages, the cover having a smooth top surface area of a size sufficient for engagement by the vacuum-suction nozzle. The cover slides onto free-ends of the at least some of pin portions of the terminals with an interference-fit between the pin portions and the pin-receiving passages in the cover. The smooth top surface area of the cover is engaged with the vacuum-suction nozzle. The header assembly and the cover are positioned together on the mounting surface of the electrical apparatus. The tail portions of the terminals are soldered to circuitry on the electrical apparatus. The cover slides off the free ends of the pin portions of the terminals. |
