| 摘要 |
The semiconductor mounting structure comprises a combined rigid and flexible substrate (10) within which a flexible part is provided. The flexible part is provided with a connection terminal for a semiconductor integrated circuit (20), the integrated circuit being mounted directly on this section. A rigid part of the composite substrate (16) is provided with an electrode (19) for mounting an electronic component, and also provided with an input/output terminal (25). The semiconductor integrated circuit is sealed and embedded in resin after mounting within the structure. A number of integrated circuits may be mounted within the flexible part of the structure, whilst the rigid part may provide support for a number of other electronic components. |
