| 摘要 |
<p>A buffer chip(32) smaller than a lead frame pad(31) is attached on a lead frame pad(31). After fixing a semiconductor chip(37) on the buffer chip(32) a process for hardening the adhesive is performed at the same time and perform wire bonding on a bonding pad(33) of the buffer chip(32) and on a bonding pad(38) of the semiconductor chip(37) and internal leads(34) by means of wave bonding or wedge bonding. The semiconductor processing is completed by performing epoxy molding and trimming forming process.</p> |
